Question about thermal paste application methods I keep going back and forth on

So I've been doing builds for about 5 years now, mostly gaming rigs for friends. Always used the pea method for thermal paste, one dot in the middle, let the cooler spread it. Last month I built a system for a guy in Phoenix and used the spread method by hand instead, covering the whole IHS myself. His temps were 5 to 7 degrees cooler under load vs my usual builds with the same chip. Now I'm wondering if I've been doing it wrong this whole time or if that was just a fluke with that specific CPU. Has anyone else compared both methods and seen a clear winner?

2 comments

2 Comments

margareth481mo ago

Nah, a 5-7 degree difference from spreading by hand sounds like a one-off fluke or maybe that CPU had a wonky IHS. Pea method works fine 99% of the time and you're way less likely to trap air bubbles.

hollyg591mo ago

The spread method can work better on some CPUs with uneven or concave IHS's, so that might be what happened with the Phoenix build. Pea method is still the safest bet for most builds since it self-levels and reduces the risk of air pockets. If you are not getting bad temps normally, stick with what works unless you see a clear reason to switch.